Scanning Acoustic Microscopy

l  UST 300A uses high-frequency ultrasound (above 5 MHz) to detect the shape, size, location, and distribution of defects inside semiconductor devices and materials, and the results are displayed as waveforms and images.

l  It is very sensitive to the bonding surface and can detect discontinuous defects such as pores, cracks, inclusions, and delaminations.

l  Non-destructive testing，which can preserve subtle defects that are lost in destructive testing, and samples can continue to be used after passing the test.

l  By detecting the distribution of material density, the mechanical properties of materials such as stress field and crack variation trend can be derived.  It also has certain capabilities in distinguishing material density differences, elastic modulus, thickness, and geometric shape changes.

1.      Technical Features

²  The scanning axis adopts magnetic levitation and dynamic balancing technology, which is high-speed and silent, allowing for fast and efficient device scanning.

²  There are various types of ultrasonic transducers, by selecting the appropriate transducer, optimal detection results can be achieved.

u  Because of the ultra-high frequency, it has no cavitation phenomenon and is harmless to both devices and human bodies. The devices can be used normally after testing.

²  Plentiful Scanning Methods, supporting Pulse-Echo and Through Transmission modes.

                      A Scan                                                            B Scan                                                                     C Scan

²  The scanning range can be customized, which is not only suitable for rapid scanning and analysis of individual devices, but also for synchronous scanning of batches of devices.

²  Automatic defect recognition function, automatic defect coloring, can quickly screen out non-conforming products. The image shows the location, shape, and size of internal defects in the device under test.

²  Scanning Methods：A scan, B scan, C scan,Contour profile (D)scan,Multi layer Scan,Layer by Layer Scan,Bulk scan,Loss of Back Echo scan,Jump scan ,Tray scan,Trough scan(optional) etc. 

²  The A waveform is displayed in real time during the scanning process, facilitating real-time adjustment of the data gate.

²  The scanning trajectory parameters can be set through software, and the starting position of B and C scanning can be set freely within the scanning range.

²  The system has the functions of power-on self-test, fault diagnosis and fault alarm indication.

²  Multi-layer scanning mode supports simultaneous scanning up to 100 layers.

²  The resolution of scanned images can reach 10000 * 10000.

²  Front surface follow-up function, which can complete scanning normally in the case of uneven devices.

²  Real-time switching between positive, negative, peak images, phase images, and TOF images.

²  Parameters such as signal gain can be changed during scanning and take effect in real time.

²  Automatic storage of setting parameters, support for extracting the parameter settings of the scanning results, facilitating secondary scanning, reducing the parameter setting time for the same device in the later stage, and improving work efficiency.

²  Automatic identification of defects, statistics of defect size and area, automatic calculation of the percentage of defects in the measured area, and real-time coloring of layered defects can be achieved.

²  Support the simultaneous display of multiple detection result images and re-analysis and processing.

²  Support length measurement of scanning results, allowing sample thickness measurement.

²  Support text annotation for scanning results.

²  Support real-time zooming of scanned images for convenient observation; 

²  Powerful image processing software package: image zooming, dragging, measuring annotation, image median filtering, mean filtering, reverse color processing, embossing processing, contrast enhancement, enhancement, pseudo-color and other processing functions; 

²  The scanning results can be saved as bmp, jpg images, or as csam files with scanning parameters;

²  Powerful automatic report export function, supporting one-click scanning results and A-waveform saving, facilitating the production of inspection reports by inspectors in the later stage.

1.      Technical specifications

²  Scanning range: 320mm×320mm(without T Scan);

320mm×160mm(with T Scan);

²  Focus adjustment stroke: 80mm;

²  Maximum scanning speed: 1000mm/s;

²  Signal bandwidth: 5-300MHz(500MHz optional);

²  Transducer frequency range: 5-230MHz;

²  Sampling frequency: 1GSample/s;